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| FDZ291P October 2005 FDZ291P P-Channel 1.5 V Specified PowerTrench(R) BGA MOSFET General Description Combining Fairchild's advanced 1.5V specified PowerTrench process with state of the art BGA packaging, the FDZ291P minimizes both PCB space This BGA MOSFET embodies a and RDS(ON). breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON). Features * -4.6 A, -20 V RDS(ON) = 40 m @ VGS = -4.5 V RDS(ON) = 60 m @ VGS = -2.5 V RDS(ON) = 160 m @ VGS = -1.5 V * Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of a SSOT-6 * Ultra-thin package: less than 0.85 mm height when mounted to PCB * Outstanding thermal transfer characteristics: 4 times better than SSOT-6 * Ultra-low Qg x RDS(ON) figure-of-merit * High power and current handling capability. S Applications * Battery management * Load switch * Battery protection GATE G D Bottom Top TA=25oC unless otherwise noted Absolute Maximum Ratings Symbol VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Parameter Ratings -20 8 (Note 1a) Units V V A W C -4.6 -10 1.7 -55 to +150 Power Dissipation for Single Operation (Note 1a) Operating and Storage Junction Temperature Range Thermal Characteristics RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1a) (Note 1a) 72 2 C/W Package Marking and Ordering Information Device Marking D Device FDZ291P Reel Size 7" Tape width 8mm Quantity 3000 units (c)2005 Fairchild Semiconductor Corporation FDZ291P Rev. C1 (W) FDZ291P Electrical Characteristics T Symbol BVDSS BVDSS TJ IDSS IGSS A = 25C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage. (Note 2) Test Conditions ID = -250 A VGS = 0 V, ID = -250 A, Referenced to 25C VDS = -16 V, VGS = 8 V, VGS = 0 V VDS = 0 V Min Typ Max Units -20 -12 -1 100 V mV/C A nA Off Characteristics On Characteristics VGS(th) VGS(th) TJ RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance ID = -250 A VDS = VGS, ID = -250 A, Referenced to 25C VGS = -4.5 V, ID = -4.6 A VGS = -2.5 V, ID = -3.6 A VGS = -1.5 V, ID = -1.0 A VGS = -4.5 V, ID = -4.6 A, TJ=125C VGS = -4.5 V, VDS = -5 V VDS = -5 V, ID = -4.6 A -0.4 -0.7 2 31 43 85 42 -1.0 V mV/C 40 60 160 55 m ID(on) gFS On-State Drain Current Forward Transconductance -10 16 A S Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) VDS = -10 V, f = 1.0 MHz V GS = 0 V, 1010 160 80 pF pF pF Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = -10 V, VGS = -4.5 V, ID = -1 A, RGEN = 6 11 9 36 16 19 18 58 29 13 ns ns ns ns nC nC nC VDS = -10V, VGS = -4.5 V ID = -4.6 A, 9 1.6 1.9 Drain-Source Diode Characteristics and Maximum Ratings IS VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward (Note 2) VGS = 0V, IS = -1.4 A Voltage Diode Reverse Recovery Time IF = -4.6 A, dIF/dt = 100A/s Diode Reverse Recovery Charge -1.4 -0.7 17 5 -1.2 A V ns nC Notes: 1. RJA is determined with the device mounted on a 1 in 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. The thermal resistance from the junction to the circuit board side of the solder ball, RJB, is defined for reference. For RJC, the thermal reference point for the case is defined as the top surface of the copper chip carrier. RJC and RJB are guaranteed by design while RJA is determined by the user's board design. a) 72C/W when mounted on a 1in2 pad of 2 oz copper, 1.5" x 1.5" x 0.062" thick PCB b) 157C/W when mounted on a minimum pad of 2 oz copper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% FDZ291P Rev. C1 (W) FDZ291P Typical Characteristics 10 VGS = -4.5V 8 -3.5V -2.5V -3.0V 6 -2.0V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 3 VGS = -1.5V 2.6 -ID, DRAIN CURRENT (A) 2.2 1.8 -2.0V 1.4 -2.5V -3.0V 1 -3.5V -4.5V 4 -1.5V 2 0 0 0.25 0.5 0.75 1 -VDS, DRAIN-SOURCE VOLTAGE (V) 1.25 1.5 0.6 0 2 4 6 -ID, DRAIN CURRENT (A) 8 10 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.14 1.5 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE RDS(ON), ON-RESISTANCE (OHM) 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 -50 ID = -4.6A VGS = -4.5V ID = -2.3 A 0.12 0.1 0.08 TA = 125oC 0.06 TA = 25 C 0.04 o 0.02 -25 0 25 50 75 100 o TJ, JUNCTION TEMPERATURE ( C) 125 150 0 2 4 6 8 -VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 3. On-Resistance Variation with Temperature. 10 -IS, REVERSE DRAIN CURRENT (A) VDS = -5V Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 VGS = 0V 10 -ID, DRAIN CURRENT (A) 8 1 6 0.1 TA = 125 C o 4 TA = 125 C o -55oC 0.01 25 C -55oC o 2 25 C o 0.001 0 0.5 0.75 1 1.25 1.5 1.75 -VGS, GATE TO SOURCE VOLTAGE (V) 2 0.0001 0 0.2 0.4 0.6 0.8 1 -VSD, BODY DIODE FORWARD VOLTAGE (V) 1.2 Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDZ291P Rev. C1 (W) FDZ291P Typical Characteristics 5 -VGS, GATE-SOURCE VOLTAGE (V) 1500 ID = -4.6A f = 1MHz VGS = 0 V 4 1200 VDS = -5V -15V CAPACITANCE (pF) Ciss 3 900 -10V 2 600 Coss 1 300 Crss 0 0 2 4 6 8 Qg, GATE CHARGE (nC) 10 12 0 0 5 10 15 -VDS, DRAIN TO SOURCE VOLTAGE (V) 20 Figure 7. Gate Charge Characteristics. 100 P(pk), PEAK TRANSIENT POWER (W) 20 Figure 8. Capacitance Characteristics. -ID, DRAIN CURRENT (A) RDS(ON) LIMIT 10 1ms 10ms 100ms 100s SINGLE PULSE RJA = 157C/W TA = 25C 15 1 10s DC VGS = -4.5V SINGLE PULSE RJA = 157oC/W TA = 25 C o 1s 10 0.1 5 0.01 0.1 1 10 -VDS, DRAIN-SOURCE VOLTAGE (V) 100 0 0.01 0.1 1 10 t1, TIME (sec) 100 1000 Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 RJA(t) = r(t) * RJA RJA = 157 C/W P(pk) t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 0.01 SINGLE PULSE 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDZ291P Rev. C1 (W) FDZ291P Dimensional Pad and Layout FDZ291P Rev. C1 (W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16 |
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